Heat dissipation module

ABSTRACT

A heat dissipation module includes multiple heat sink fins. The heat sink fins are assembled to one another along an assembly axis, and each of the heat sink fins includes a main body and an extension plate. The extension plate extends from one side of the main body towards an opposite side of the main body. An acute angle is formed between the extension plate and the main body. Each of the extension plates is located between the main bodies of the two heat sink fins adjacent to each other.

CROSS-REFERENCE TO RELATED APPLICATIONS

This non-provisional application claims priority under 35 U.S.C. §119(a)on Patent Application No(s). 201210427755.0 filed in China, P.R.C. onOct. 31, 2012, the entire contents of which are hereby incorporated byreference.

BACKGROUND OF THE INVENTION

1. Technical Field of the Invention

The disclosure relates to a heat dissipation module, and moreparticularly to a heat dissipation module with an increased heatdissipation area.

2. Description of the Related Art

With the constant development of technologies in the electronics field,the performance of electronic component products continuously improves.However, generally speaking, as the performance of an electroniccomponent improves, more heat is generated. Accumulation of the heat onthe electronic component leads to a temperature increase of theelectronic component. When the heat cannot be effectively dissipatedfrom the electronic component to lower the temperature of the electroniccomponent, the electronic component may break down, or even burn out.Therefore, compared with the issue of improving performance of theelectronic component, how to effectively dissipate the heat thereof is amore common problem encountered in the electronics field.

Generally, water-cooled heat dissipation devices and air-cooled heatdissipation devices are used to dissipate the heat generated by theelectronic components in the industry. The heat dissipation principle ofthe water-cooled heat dissipation device is to use a compressor or pumpto drive a cooling fluid in a cooling tube to exchange heat with theelectronic component. Thereby, the heat of the electronic component isdissipated. The heat dissipation principle of the air-cooled heatdissipation device is to use a fan to guide cool air to flow by theelectronic component for heat exchange to dissipate the heat of theelectronic component. Compared with the water-cooled heat dissipationdevice, the air-cooled heat dissipation device does not require thecompressor, the pump and the cooling fluid. Thus, the air-cooled heatdissipation device is more competitive in terms of cost. Therefore, theair-cooled heat dissipation device is commonly used to dissipate theheat of the electronic component in the industry.

However, the existing air-cooled heat dissipation device still cannoteffectively dissipate the heat generated by high-level electroniccomponents that are available on the market. Therefore, given the costand the heat dissipation performance, it is necessary to develop anair-cooled heat dissipation device with higher heat dissipationperformance.

SUMMARY OF THE INVENTION

An embodiment of the disclosure provides a heat dissipation modulecomprising a plurality of heat sink fins. The heat sink fins areassembled to one another along an assembly axis. Each of the heat sinkfins comprises a main body and an extension plate. The extension plateextends from one side of the main body towards an opposite side of themain body. An acute angle is formed between the extension plate and themain body. Each of the extension plates is located between the mainbodies of the two heat sink fins adjacent to each other.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will become more fully understood from the detaileddescription given herein below for illustration only, and thus does notlimit the disclosure, wherein:

FIG. 1 is a perspective view of a heat dissipation module according to afirst embodiment of the disclosure;

FIG. 2 is a sectional view in FIG. 1;

FIG. 3 is a sectional view of a heat sink fin in FIG. 1;

FIG. 4 is a sectional view of a heat sink fin according to a secondembodiment;

FIG. 5A is a sectional view of a heat sink fin according to a thirdembodiment;

FIG. 5B is a sectional view of a heat sink fin according to a fourthembodiment;

FIG. 5C is a sectional view of a heat sink fin according to a fifthembodiment; and

FIG. 6 is a sectional view of a heat sink fin according to a sixthembodiment.

DETAILED DESCRIPTION

In the following detailed description, for purposes of explanation,numerous specific details are set forth in order to provide a thoroughunderstanding of the disclosed embodiments. It will be apparent,however, that one or more embodiments may be practiced without thesespecific details. In other instances, well-known structures and devicesare schematically shown in order to simplify the drawing.

Please refer to FIG. 1 to FIG. 3. FIG. 1 is a perspective view of a heatdissipation module according to a first embodiment of the disclosure.FIG. 2 is a sectional view in FIG. 1. FIG. 3 is a sectional view of aheat sink fin in FIG. 1.

A heat dissipation module 10 of this embodiment comprises multiple heatsink fins 100 and a heat pipe 200. The heat sink fins 100 are assembledto one another along an assembly axis (the direction indicated by anarrow ‘a’), and the heat pipe 200 runs through the heat sink fins 100along the assembly axis. Each of the heat sink fins 100 comprises a mainbody 105 and an extension plate 140. The extension plate 140 extendsfrom one side of the main body 105 towards an opposite side of the mainbody 105, and an acute angle θ is formed between the extension plate 140and the main body 105. Each of the extension plates 140 is locatedbetween the main bodies 105 of the two heat sink fins 100 adjacent toeach other.

Specifically, the main body 105 comprises a first plate body 110, asecond plate body 120 and a third plate body 130. The second plate body120 and the third plate body 130 are connected to the two opposite sidesof the first plate body 110 respectively. Therefore, in this embodiment,the cross section of the main body 105 is U-shaped. The extension plate140 is connected to the second plate body 120, and extends from thesecond plate body 120 towards the third plate body 130. Thereby, theheat dissipation area of the heat sink fin 100 is increased. An acuteangle θ is formed between the extension plate 140 and the first platebody 110. In this embodiment, the extension plate 140 is leaned againstthe third plate body 130. An acute angle θ is formed between theextension plate 140 and the second plate body 120. In other words, aclearance between one end of the extension plate 140 adjacent to thesecond plate body 120 and the first plate body 110 is greater than thatbetween one end of the extension plate 140 adjacent to the third platebody 130 and the first plate body 110. In addition, the assembly axis istowards a direction perpendicular to the first plate body.

In this embodiment, since an acute angle is formed between the extensionplate 140 and the second plate body 120, a sufficient space is providedfor air flowing between the extension plate 140 and the two first platebodies 110 adjacent to each other. Thereby, a high heat dissipationefficiency is achieved. Therefore, in a limited space, the extensionplate 140 of the heat dissipation module 10 of this embodiment increasesthe heat dissipation area of the heat dissipation module 10 and theangle between the extension plate 140 and the second plate body 120maintains an air-flow space inside the heat sink fins 100 such that anairflow may flow through the heat sink fins 100. Thereby the heatdissipation efficiency of the heat dissipation module 10 is improved.

In this embodiment, the heat pipe 200 runs through the first platebodies 110 and the extension plates 140 at the same time, so as totransfer heat absorbed by the heat pipe 200 to the first plate bodies110 and the extension plates 140 for dissipation.

In this embodiment, the heat dissipation module 10 comprises the heatpipe 200, but the disclosure is not limited thereto. In otherembodiments, the heat dissipation module 10 may not comprise the heatpipe 200.

The extension plate 140 according to the embodiment in FIG. 1 is leanedagainst the third plate body 130, but the disclosure is not limitedthereto. In other embodiments, the extension plate 140 also may not beleaned against the third plate body 130. Referring to FIG. 4, FIG. 4 isa sectional view of a heat sink fin according to a second embodiment.The heat dissipation module 10 of this embodiment comprises multipleheat sink fins 100 and a heat pipe 200. The heat sink fins 100 areassembled to one another along an assembly axis (the direction indicatedby the arrow ‘a’). Moreover, the heat pipe 200 runs through the heatsink fins 100 along the assembly axis.

Each of the heat sink fins 100 comprises a main body 105 and anextension plate 140. Specifically, the main body 105 comprises a firstplate body 110, a second plate body 120 and a third plate body 130. Thesecond plate body 120 and the third plate body 130 extend from the twoopposite ends of the first plate body 110 towards the same side of thefirst plate body 110 respectively. The extension plate 140 is connectedto the second plate body 120 as well as extends towards the third platebody 130. Thereby, the heat dissipation area of the heat sink fin 100 isincreased. In this embodiment, the extension plate 140 is not pressedagainst the third plate body 130. That is, the extension plate 140 isseparated from the third plate body 130. In addition, in thisembodiment, the length of the extension plate 140 is about half of thatof the first plate body 110, but the disclosure is not limited thereto.In other embodiments, the length of the extension plate 140 may beadjusted according to actual needs.

In the embodiment in FIG. 1, the cross section of the main body 105 is aU-shaped structure, but the disclosure is not limited thereto. In otherembodiments, the cross section of the main body 105 may be an L-shapedstructure, an L-like shaped structure or an I-shaped structure. Pleaserefer to FIG. 5A, FIG. 5B, FIG. 5C and FIG. 6. FIG. 5A is a sectionalview of a heat sink fin according to a third embodiment. FIG. 5B is asectional view of a heat sink fin according to a fourth embodiment. FIG.5C is a sectional view of a heat sink fin according to a fifthembodiment. FIG. 6 is a sectional view of a heat sink fin according to asixth embodiment. As shown in FIG. 5A, the heat sink fin 100 of thisembodiment comprises a main body 105 and an extension plate 140. Themain body 105 comprises a first plate body 110 and a second plate body120. The second plate body 120 is disposed on one side of the firstplate body 110. That is, the cross section of the main body 105 is anL-shaped structure. The extension plate 140 extends from the secondplate body 120 towards the other side of the first plate body 100.Moreover, an acute angle θ is formed between the extension plate 140 andthe second plate body 120.

As shown in FIG. 5B, the heat sink fin 100 of this embodiment comprisesa main body 105 and an extension plate 140. The main body 105 comprisesa first plate body 110 and a second plate body 120. The second platebody 120 is disposed on one side of the first plate body 110. That is,the cross section of the main body 105 is an L-shaped structure. Oneside of the first plate body 110 of the extension plate 140 away fromthe second plate body 120 extends towards the second plate body 120.Furthermore, an acute angle θ is formed between the extension plate 140and the first plate body 110.

As shown in FIG. 5C, the heat sink fin 100 of this embodiment comprisesa main body 105 and an extension plate 140. The main body 105 comprisesa first plate body 110 and a second plate body 120. The second platebody 120 is connected to one side of the first plate body 110. An obtuseangle is formed between the second plate body 120 and the first platebody 110. That is, the cross section of the main body 105 is an L-likeshaped structure. The extension plate 140 extends from the second platebody 120 towards the other side of the first plate body 110. Moreover,an acute angle θ is formed between the extension plate 140 and thesecond plate body 120.

As shown in FIG. 6, the heat sink fin 100 of this embodiment comprises amain body 105 and an extension plate 140. The main body 105 comprises afirst plate body 110. That is, the cross section of the main body 105 isan I-shaped structure. The extension plate 140 extends from one side ofthe first plate body 110 towards the other side of the first plate body110. Also, an acute angle θ is formed between the extension plate 140and the first plate body 110.

According to the heat dissipation module of the disclosure, the heatsink fin is provided with the extension plate to increase the heatdissipation area of the heat sink fin, and an acute angle is formedbetween the extension plate and the main body. Therefore, a sufficientspace is provided for air flowing between the extension plate and themain body, so as to enable the heat dissipation module to achieve ahigher heat dissipation efficiency.

What is claimed is:
 1. A heat dissipation module, comprising a pluralityof heat sink fins, the heat sink fins being assembled to one anotheralong an assembly axis, and each of the heat sink fins comprising: amain body; and an extension plate, extending from one side of the mainbody towards an opposite side of the main body, an acute angle beingformed between the extension plate and the main body; wherein each ofthe extension plates is located between the main bodies of the two heatsink fins adjacent to each other.
 2. The heat dissipation moduleaccording to claim 1, wherein the main body comprises a first plate bodyand a second plate body, the second plate body is connected to one sideof the first plate body, and an obtuse angle is formed between thesecond plate body and the first plate body, the extension plate extendsfrom the second plate body towards the other side of the first platebody, and an acute angle is formed between the extension plate and thesecond plate body.
 3. The heat dissipation module according to claim 1,wherein the main body comprises a first plate body and a second platebody, the second plate body is disposed on one side of the first platebody, the extension plate extends from the second plate body towards theother side of the first plate body, and an acute angle is formed betweenthe extension plate and the second plate body.
 4. The heat dissipationmodule according to claim 3, wherein one side of the first plate body ofthe extension plate away from the second plate body extends towards thesecond plate body, and an acute angle is formed between the extensionplate and the first plate body.
 5. The heat dissipation module accordingto claim 1, wherein the main body comprises a first plate body, a secondplate body and a third plate body, the second plate body and the thirdplate body are connected to two opposite sides of the first plate bodyrespectively, the extension plate is connected to the second plate bodyas well as extends from the second plate body towards the third platebody, and an acute angle is formed between the extension plate and thesecond plate body.
 6. The heat dissipation module according to claim 5,wherein the extension plate is separated from the second plate body. 7.The heat dissipation module according to claim 5, wherein the extensionplate is against the third plate body.
 8. The heat dissipation moduleaccording to claim 1, further comprising a heat pipe, the heat piperunning through the heat sink fins along the assembly axis
 9. The heatdissipation module according to claim 1, wherein the main body is anI-shaped module, a C-shaped module, an L-shaped module or an L-likeshaped module.